Job Details

Failure Analysis Engineer

Foxconn Technology Group, a global leader in electronics manufacturing, is seeking a Failure Analysis Engineer to lead root cause investigations and drive process optimization. Once a part of the team you will have opportunity to lead real-time yield monitoring and rapid anomaly resolution to maintain target performance; drive dynamic analysis of defective main logic board to build troubleshooting expertise and streamline diagnostics; compile and deliver product analysis and yield reports to inform decision-making.

Duties and Responsibilities

• Track production yield in real time, analyze trends weekly/monthly, and flag critical anomalies for leadership review.
• Diagnose main logic board defects using advanced tools (oscilloscopes, spectrum analyzers, etc.) to identify root causes.
• Respond immediately to yield deviations, lead Root Cause Analysis, and implement Corrective & Preventive Actions to resolve issues.
• Adhere to company policies and Standard Operating Procedures for quality inspections to ensure consistent, standards-based processes.
• Deliver weekly yield reports and present monthly trends/anomalies to stakeholders for strategic decision-making.
• Identify process risks through continuous yield monitoring and recommend improvements to strengthen quality outcomes.

Skills:

• Proficiency in circuit architecture, testing principles, chip functionality, component specifications, and circuit design principles.
• Proficient with diagnostics instrumentation (oscilloscopes, multimeters, spectrum analyzers) to troubleshoot hardware issues and analyze faults.
• Analytical problem-solving and clear communication skills to craft technical reports and deliver actionable insights to teams and clients.