Foxconn Industrial Internet (FII) provides innovative design and advanced manufacturing capabilities. FII centers around Cloud Based Computing, Big Data, High-Speed Networks, Automation, and Industry 4.0 methodology. Join an expansive network of professionals who work together within a company culture of one shared mission. FII is seeking a highly motivated Thermal Mechanical Engineer with expertise in thermal and fluids engineering to contribute to the cooling of servers.
As a part of the Server R&D team, the Thermal Mechanical Engineers utilize CAD software to address thermal challenges in support of server designs and technical proposals, review design work with customers and collaborate with multi-functional teams to optimize designs, validate design work, and release the products to volume manufacturing.
Minimum of Bachelor's degree in an Engineering Discipline. An advanced engineering degree (MS or Ph.D.) with an emphasis on thermal sciences would be an added plus.
Strong fundamental backgrounds in heat transfer and fluid mechanics, understanding of cooling techniques for electronic components and equipment such as the passive and active heat transfer, air cooling, liquid cooling, two-phase immersion cooling, heat sinks, heat pipes, vapor chambers and fans thorough graduate level course works or industry experiences.
Knowledge of semiconductor, package and PCB designs and thermal testing. Experience working with Integrated Circuit (IC) physical design parameters affecting electrical and thermal performance of packaging technologies. Thermal Mechanical Engineer
Knowledge of the thermal analysis and computational modeling, development of thermal solutions and methodologies at the server and system-level for semi-conductor products, data analysis and product characterizations, optimizations of thermal controls for increased quality and cost improvements, developments of thermal management techniques
Strong knowledge of CFD principals as well as working experiences in creating analytical and numerical modes using CFD tools such as FloTherm, ANSYS-IcePak and Fluent etc.
Experience with defining thermal test plans, design of experiments on prototypes. Experiences in instrumentations, data acquisitions and data analysis, including uncertainty analysis. Experiences with various temperature, pressure and fluid flow measurement techniques. Basic controls, automations, acoustical knowledge is a plus.
Some experience with 3D/2D models utilizing CAD tools such as PTC Creo or Pro/Engineer or SolidWorks etc. is a major plus.
Good ability to visualize and clarify product needs from fundamental concepts through system considerations to ensure optimized designs.
Good written and verbal communication skills, strong analytical and problem solving ability and effective teamwork throughout the organizations.
Benefits: